Qualcomm ≫ Snapdragon Xr2 5g Platform Firmware

193 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-28546

Memory Corruption in SPS Application while exporting public key in sorter TA.

7.8

Memory corruption in MPP performance while accessing DSM watermark using external memory address.

7.8

Memory Corruption in Audio while invoking callback function in driver from ADSP.

7.8

Memory corruption in Audio while processing the VOC packet data from ADSP.

7.8

Memory corruption in Audio when SSR event is triggered after music playback is stopped.

7.8

Memory corruption while processing audio effects.

7.8

Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.

9.8

Memory corruption in WLAN Firmware while parsing a NAN management frame carrying a S3 attribute.

7.5

Transient DOS in WLAN Firmware while parsing no-inherit IES.

5.5

Information Disclosure in Qualcomm IPC while reading values from shared memory in VM.