Qualcomm ≫ Snapdragon Ar2 Gen 1 Platform Firmware

149 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

6.5

CVE-2025-47370

Transient DOS when a remote device sends an invalid connection request during BT connectable LE scan.

7.8

Memory corruption while performing encryption and decryption commands.

7.8

Memory corruption while processing a malformed license file during reboot.

7.8

Memory corruption during PlayReady APP usecase while processing TA commands.

7.5

Transient DOS while parsing the EPTM test control message to get the test pattern.

7.8

memory corruption while loading a PIL authenticated VM, when authenticated VM image is loaded without maintaining cache coherency.

7.1

Cryptographic issue while performing RSA PKCS padding decoding.

7.5

Transient DOS while creating NDP instance.

7.5

Transient DOS while processing an ANQP message.

7.5

Transient DOS while processing a frame with malformed shared-key descriptor.