Qualcomm ≫ Qca6678aq Firmware

180 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

5.5

CVE-2025-21433

Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.

7.8

Memory corruption while retrieving the CBOR data from TA.

8.2

Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.

7.8

Cryptographic issue while processing crypto API calls, missing checks may lead to corrupted key usage or IV reuses.

7.8

Memory corruption while operating the mailbox in Automotive.

6.6

Memory corruption may occur while processing voice call registration with user.

7.5

Transient DOS while parsing per STA profile in ML IE.

7.8

Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.

7.5

Transient DOS while processing of a registration acceptance OTA due to incorrect ciphering key data IE.

9.1

Memory corruption while decoding of OTA messages from T3448 IE.