Qualcomm ≫ Sg4150p Firmware

225 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2022-33264

Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.

5.5

information disclosure due to cryptographic issue in Core during RPMB read request.

7.5

Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network.

7.8

Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it.

7.5

Transient DOS due to NULL pointer dereference in Modem while sending invalid messages in DCCH.

7.8

Memory Corruption in Multimedia Framework due to integer overflow when synx bind is called along with synx signal.

7.8

Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.

7.8

Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length.

6.8

Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.

7.8

Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity.