Qualcomm ≫ Sg8275p Firmware

205 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2024-53014

Memory corruption may occur while validating ports and channels in Audio driver.

7.8

Memory corruption in display driver while detaching a device.

5.5

Information disclosure while deriving keys for a session for any Widevine use case.

6.5

Transient DOS during hypervisor virtual I/O operation in a virtual machine.

7.8

Memory corruption can occur in the camera when an invalid CID is used.

7.8

Memory corruption while power-up or power-down sequence of the camera sensor.

9.8

Memory corruption during management frame processing due to mismatch in T2LM info element.

7.8

Memory corruption while registering a buffer from user-space to kernel-space using IOCTL calls.

7.8

Memory corruption when input parameter validation for number of fences is missing for fence frame IOCTL calls,

7.8

Memory corruption while invoking IOCTL calls to unmap the DMA buffers.