Qualcomm ≫ Sg8275p Firmware

193 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2023-33099

Transient DOS while processing SMS container of non-standard size received in DL NAS transport in NR.

7.5

Transient DOS while processing DL NAS Transport message when message ID is not defined in the 3GPP specification.

7.5

Transient DOS while processing DL NAS TRANSPORT message with payload length 0.

7.8

Memory corruption in SPS Application while requesting for public key in sorter TA.

7.8

Memory corruption while processing finish_sign command to pass a rsp buffer.

9.8

Memory corruption while processing MBSSID beacon containing several subelement IE.

7.8

Memory corruption while processing TPC target power table in FTM TPC.

7.8

Memory corruption while invoking HGSL IOCTL context create.

7.8

Memory corruption while invoking IOCTLs calls in Automotive Multimedia.

7.5

Transient DOS while processing CAG info IE received from NW.