8.4

CVE-2022-25697

Memory corruption in i2c buses due to improper input validation while reading address configuration from i2c driver in Snapdragon Mobile, Snapdragon Wearables

Daten sind bereitgestellt durch National Vulnerability Database (NVD)
QualcommSd 8 Gen1 5g Firmware Version-
   QualcommSm8475 Version-
QualcommSd429 Firmware Version-
   QualcommSd429 Version-
QualcommSda429w Firmware Version-
   QualcommSda429w Version-
QualcommSdm429w Firmware Version-
   QualcommSdm429w Version-
QualcommWcd9380 Firmware Version-
   QualcommWcd9380 Version-
QualcommWcn3610 Firmware Version-
   QualcommWcn3610 Version-
QualcommWcn3620 Firmware Version-
   QualcommWcn3620 Version-
QualcommWcn3660b Firmware Version-
   QualcommWcn3660b Version-
QualcommWcn3680b Firmware Version-
   QualcommWcn3680b Version-
QualcommWcn3980 Firmware Version-
   QualcommWcn3980 Version-
QualcommWcn6855 Firmware Version-
   QualcommWcn6855 Version-
QualcommWcn6856 Firmware Version-
   QualcommWcn6856 Version-
QualcommWcn7850 Firmware Version-
   QualcommWcn7850 Version-
QualcommWcn7851 Firmware Version-
   QualcommWcn7851 Version-
QualcommWsa8830 Firmware Version-
   QualcommWsa8830 Version-
QualcommWsa8835 Firmware Version-
   QualcommWsa8835 Version-
Zu dieser CVE wurde keine CISA KEV oder CERT.AT-Warnung gefunden.
EPSS Metriken
Typ Quelle Score Percentile
EPSS FIRST.org 0.05% 0.149
CVSS Metriken
Quelle Base Score Exploit Score Impact Score Vector String
nvd@nist.gov 7.8 1.8 5.9
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
product-security@qualcomm.com 8.4 2.5 5.9
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
CWE-787 Out-of-bounds Write

The product writes data past the end, or before the beginning, of the intended buffer.