10
CVE-2019-10612
- EPSS 0.36%
- Veröffentlicht 05.03.2020 09:15:16
- Zuletzt bearbeitet 21.11.2024 04:19:35
- Quelle product-security@qualcomm.com
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UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Daten sind bereitgestellt durch National Vulnerability Database (NVD)
Qualcomm ≫ Mdm9205 Firmware Version-
Qualcomm ≫ Mdm9650 Firmware Version-
Qualcomm ≫ Qcs605 Firmware Version-
Qualcomm ≫ Sa6155p Firmware Version-
Qualcomm ≫ Sc8180x Firmware Version-
Qualcomm ≫ Sda845 Firmware Version-
Qualcomm ≫ Sdm670 Firmware Version-
Qualcomm ≫ Sdm710 Firmware Version-
Qualcomm ≫ Sdm845 Firmware Version-
Qualcomm ≫ Sdm850 Firmware Version-
Qualcomm ≫ Sdx55 Firmware Version-
Qualcomm ≫ Sm6150 Firmware Version-
Qualcomm ≫ Sm7150 Firmware Version-
Qualcomm ≫ Sm8150 Firmware Version-
Qualcomm ≫ Sm8250 Firmware Version-
Qualcomm ≫ Sxr1130 Firmware Version-
Qualcomm ≫ Sxr2130 Firmware Version-
Zu dieser CVE wurde keine CISA KEV oder CERT.AT-Warnung gefunden.
Typ | Quelle | Score | Percentile |
---|---|---|---|
EPSS | FIRST.org | 0.36% | 0.549 |
Quelle | Base Score | Exploit Score | Impact Score | Vector String |
---|---|---|---|---|
nvd@nist.gov | 9.8 | 3.9 | 5.9 |
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
|
nvd@nist.gov | 10 | 10 | 10 |
AV:N/AC:L/Au:N/C:C/I:C/A:C
|
CWE-787 Out-of-bounds Write
The product writes data past the end, or before the beginning, of the intended buffer.