7.8
CVE-2018-11258
- EPSS 0.05%
- Published 06.07.2018 17:29:00
- Last modified 21.11.2024 03:43:00
- Source product-security@qualcomm.com
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In ADSP RPC in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, a Use After Free condition can occur in versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Data is provided by the National Vulnerability Database (NVD)
Qualcomm ≫ Mdm9206 Firmware Version-
Qualcomm ≫ Mdm9607 Firmware Version-
Qualcomm ≫ Mdm9650 Firmware Version-
Qualcomm ≫ Msm8909w Firmware Version-
Qualcomm ≫ Msm8996au Firmware Version-
Qualcomm ≫ Sd 210 Firmware Version-
Qualcomm ≫ Sd 212 Firmware Version-
Qualcomm ≫ Sd 205 Firmware Version-
Qualcomm ≫ Sd 425 Firmware Version-
Qualcomm ≫ Sd 450 Firmware Version-
Qualcomm ≫ Sd 615 Firmware Version-
Qualcomm ≫ Sd 616 Firmware Version-
Qualcomm ≫ Sd 415 Firmware Version-
Qualcomm ≫ Sd 625 Firmware Version-
Qualcomm ≫ Sd 650 Firmware Version-
Qualcomm ≫ Sd 652 Firmware Version-
Qualcomm ≫ Sd 820 Firmware Version-
Qualcomm ≫ Sd 820a Firmware Version-
Qualcomm ≫ Sd 835 Firmware Version-
Qualcomm ≫ Sd 845 Firmware Version-
Qualcomm ≫ Sdx20 Firmware Version-
Zu dieser CVE wurde keine CISA KEV oder CERT.AT-Warnung gefunden.
| Type | Source | Score | Percentile |
|---|---|---|---|
| EPSS | FIRST.org | 0.05% | 0.126 |
| Source | Base Score | Exploit Score | Impact Score | Vector string |
|---|---|---|---|---|
| nvd@nist.gov | 7.8 | 1.8 | 5.9 |
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
|
| nvd@nist.gov | 4.6 | 3.9 | 6.4 |
AV:L/AC:L/Au:N/C:P/I:P/A:P
|
CWE-416 Use After Free
The product reuses or references memory after it has been freed. At some point afterward, the memory may be allocated again and saved in another pointer, while the original pointer references a location somewhere within the new allocation. Any operations using the original pointer are no longer valid because the memory "belongs" to the code that operates on the new pointer.