5.7

CVE-2017-18313

Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.
Daten sind bereitgestellt durch National Vulnerability Database (NVD)
Qualcomm ≫ Msm8909w Firmware Version -
   Qualcomm ≫ Msm8909w Version -
Qualcomm ≫ Sd 210 Firmware Version -
   Qualcomm ≫ Sd 210 Version -
Qualcomm ≫ Sd 212 Firmware Version -
   Qualcomm ≫ Sd 212 Version -
Qualcomm ≫ Sd 205 Firmware Version -
   Qualcomm ≫ Sd 205 Version -
Qualcomm ≫ Sd 410 Firmware Version -
   Qualcomm ≫ Sd 410 Version -
Qualcomm ≫ Sd 412 Firmware Version -
   Qualcomm ≫ Sd 412 Version -
Qualcomm ≫ Sd 615 Firmware Version -
   Qualcomm ≫ Sd 615 Version -
Qualcomm ≫ Sd 616 Firmware Version -
   Qualcomm ≫ Sd 616 Version -
Qualcomm ≫ Sd 415 Firmware Version -
   Qualcomm ≫ Sd 415 Version -
Qualcomm ≫ Sd 617 Firmware Version -
   Qualcomm ≫ Sd 617 Version -
Zu dieser CVE wurde keine Warnung gefunden.
EPSS Metriken
Typ Quelle Score Percentile
EPSS FIRST.org 0.26% 0.167
CVSS Metriken
Quelle Base Score Exploit Score Impact Score Vector String
NIST 5.3 1.6 3.6
CVSS:3.0/AV:A/AC:H/PR:N/UI:N/S:U/C:N/I:H/A:N
NIST 5.7 5.5 6.9
AV:A/AC:M/Au:N/C:N/I:C/A:N
Es wurden noch keine Informationen zu CWE veröffentlicht.
https://www.qualcomm.com/company/product-security/bulletins
Vendor Advisory
https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components
Third Party Advisory