7

CVE-2017-18305

XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.
Daten sind bereitgestellt durch National Vulnerability Database (NVD)
Qualcomm ≫ Mdm9206 Firmware Version -
   Qualcomm ≫ Mdm9206 Version -
Qualcomm ≫ Mdm9607 Firmware Version -
   Qualcomm ≫ Mdm9607 Version -
Qualcomm ≫ Mdm9650 Firmware Version -
   Qualcomm ≫ Mdm9650 Version -
Qualcomm ≫ Sd 210 Firmware Version -
   Qualcomm ≫ Sd 210 Version -
Qualcomm ≫ Sd 212 Firmware Version -
   Qualcomm ≫ Sd 212 Version -
Qualcomm ≫ Sd 205 Firmware Version -
   Qualcomm ≫ Sd 205 Version -
Qualcomm ≫ Sd 835 Firmware Version -
   Qualcomm ≫ Sd 835 Version -
Zu dieser CVE wurde keine Warnung gefunden.
EPSS Metriken
Typ Quelle Score Percentile
EPSS FIRST.org 0.24% 0.141
CVSS Metriken
Quelle Base Score Exploit Score Impact Score Vector String
NIST 7 1 5.9
CVSS:3.0/AV:L/AC:H/PR:L/UI:N/S:U/C:H/I:H/A:H
NIST 6.9 3.4 10
AV:L/AC:M/Au:N/C:C/I:C/A:C
Es wurden noch keine Informationen zu CWE veröffentlicht.
http://www.securitytracker.com/id/1041432
Third Party Advisory
VDB Entry
https://www.qualcomm.com/company/product-security/bulletins
Vendor Advisory
https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
Third Party Advisory