7.8
CVE-2017-18297
- EPSS 0.05%
- Veröffentlicht 23.10.2018 13:29:01
- Zuletzt bearbeitet 21.11.2024 03:19:48
- Quelle product-security@qualcomm.com
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Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Daten sind bereitgestellt durch National Vulnerability Database (NVD)
Qualcomm ≫ Sd 425 Firmware Version-
Qualcomm ≫ Sd 430 Firmware Version-
Qualcomm ≫ Sd 450 Firmware Version-
Qualcomm ≫ Sd 625 Firmware Version-
Qualcomm ≫ Sd 650 Firmware Version-
Qualcomm ≫ Sd 652 Firmware Version-
Qualcomm ≫ Sd 820 Firmware Version-
Zu dieser CVE wurde keine CISA KEV oder CERT.AT-Warnung gefunden.
| Typ | Quelle | Score | Percentile |
|---|---|---|---|
| EPSS | FIRST.org | 0.05% | 0.156 |
| Quelle | Base Score | Exploit Score | Impact Score | Vector String |
|---|---|---|---|---|
| nvd@nist.gov | 7.8 | 1.8 | 5.9 |
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
|
| nvd@nist.gov | 7.2 | 3.9 | 10 |
AV:L/AC:L/Au:N/C:C/I:C/A:C
|
CWE-415 Double Free
The product calls free() twice on the same memory address, potentially leading to modification of unexpected memory locations.