7.8

CVE-2017-18297

Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Daten sind bereitgestellt durch National Vulnerability Database (NVD)
Qualcomm ≫ Sd 425 Firmware Version-
   Qualcomm ≫ Sd 425 Version-
Qualcomm ≫ Sd 430 Firmware Version-
   Qualcomm ≫ Sd 430 Version-
Qualcomm ≫ Sd 450 Firmware Version-
   Qualcomm ≫ Sd 450 Version-
Qualcomm ≫ Sd 625 Firmware Version-
   Qualcomm ≫ Sd 625 Version-
Qualcomm ≫ Sd 650 Firmware Version-
   Qualcomm ≫ Sd 650 Version-
Qualcomm ≫ Sd 652 Firmware Version-
   Qualcomm ≫ Sd 652 Version-
Qualcomm ≫ Sd 820 Firmware Version-
   Qualcomm ≫ Sd 820 Version-
Zu dieser CVE wurde keine Warnung gefunden.
EPSS Metriken
Typ Quelle Score Percentile
EPSS FIRST.org 0.26% 0.171
CVSS Metriken
Quelle Base Score Exploit Score Impact Score Vector String
nvd@nist.gov 7.8 1.8 5.9
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
nvd@nist.gov 7.2 3.9 10
AV:L/AC:L/Au:N/C:C/I:C/A:C
CWE-415 Double Free

The product calls free() twice on the same memory address.

http://www.securitytracker.com/id/1041432
Third Party Advisory
VDB Entry
https://www.qualcomm.com/company/product-security/bulletins
Vendor Advisory
https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
Third Party Advisory