Qualcomm ≫ Sm6375 Firmware

132 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-33022

Memory corruption in HLOS while invoking IOCTL calls from user-space.

7.8

Memory Corruption in Audio while invoking callback function in driver from ADSP.

7.8

Memory corruption in Audio while processing the VOC packet data from ADSP.

7.8

Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.

7.8

Memory corruption in DSP Service during a remote call from HLOS to DSP.

7.8

Memory corruption while parsing the ADSP response command.

7.8

Memory corruption while invoking callback function of AFE from ADSP.

7.5

Transient DOS in WLAN Firmware while parsing rsn ies.

7.5

Cryptographic issue in Data Modem due to improper authentication during TLS handshake.

7.8

Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload.