Qualcomm ≫ Sm7315 Firmware

357 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

9.8

CVE-2023-43518

Memory corruption in video while parsing invalid mp2 clip.

9.8

Memory corruption in video while parsing the Videoinfo, when the size of atom is greater than the videoinfo size.

7.8

Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points.

7.8

Memory corruption in Audio while processing IIR config data from AFE calibration block.

7.8

Memory corruption in Audio while processing the calibration data returned from ACDB loader.

7.8

Memory corruption in Core while processing control functions.

7.5

Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.

7.5

Transient DOS in Multi-Mode Call Processor while processing UE policy container.

7.1

Information disclosure in Audio while accessing AVCS services from ADSP payload.

7.5

Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header.