Qualcomm

Sm7325p Firmware

397 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
  • EPSS 0.04%
  • Published 03.06.2024 10:15:11
  • Last modified 11.08.2025 15:06:17

Memory corruption in Hypervisor when platform information mentioned is not aligned.

  • EPSS 0.04%
  • Published 03.06.2024 10:15:10
  • Last modified 11.08.2025 15:06:17

Memory corruption while copying a keyblob`s material when the key material`s size is not accurately checked.

  • EPSS 0.06%
  • Published 06.05.2024 15:15:21
  • Last modified 11.08.2025 15:06:17

Memory corruption in HLOS while checking for the storage type.

  • EPSS 0.11%
  • Published 06.05.2024 15:15:21
  • Last modified 11.08.2025 15:06:17

Memory corruption when IOMMU unmap of a GPU buffer fails in Linux.

  • EPSS 0.11%
  • Published 06.05.2024 15:15:21
  • Last modified 11.08.2025 15:06:17

Memory corruption when the payload received from firmware is not as per the expected protocol size.

  • EPSS 0.15%
  • Published 06.05.2024 15:15:20
  • Last modified 11.08.2025 15:06:17

Transient DOS while processing IKEv2 Informational request messages, when a malformed fragment packet is received.

  • EPSS 0.06%
  • Published 01.04.2024 15:15:49
  • Last modified 11.08.2025 15:06:17

Memory corruption when there is failed unmap operation in GPU.

  • EPSS 0.12%
  • Published 01.04.2024 15:15:47
  • Last modified 11.08.2025 15:06:17

Transient DOS while processing SMS container of non-standard size received in DL NAS transport in NR.

  • EPSS 0.11%
  • Published 01.04.2024 15:15:47
  • Last modified 11.08.2025 15:06:17

Transient DOS while processing DL NAS TRANSPORT message with payload length 0.

  • EPSS 0.05%
  • Published 01.04.2024 15:15:47
  • Last modified 11.08.2025 15:06:17

Information disclosure when VI calibration state set by ADSP is greater than MAX_FBSP_STATE in the response payload to AFE calibration command.