Qualcomm ≫ Sd870 Firmware

380 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

5.5

CVE-2022-33220

Information disclosure in Automotive multimedia due to buffer over-read.

7.8

Memory corruption while allocating memory in COmxApeDec module in Audio.

7.1

Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key.

7.8

Memory corruption in Trusted Execution Environment while calling service API with invalid address.

6.5

Information disclosure in Bluetooth when an GATT packet is received due to improper input validation.

7.8

Memory corruption in WLAN while running doDriverCmd for an unspecific command.

7.8

Memory Corruption in GPS HLOS Driver when injectFdclData receives data with invalid data length.

7.8

Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE.

7.1

Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use.

7.8

Memory Corruption in Audio while playing amrwbplus clips with modified content.