Qualcomm ≫ Wcd9375 Firmware

Memory corruption when keymaster operation imports a shared key.

Memory corruption during session sign renewal request calls in HLOS.

Memory corruption when preparing a shared memory notification for a memparcel in Resource Manager.

Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size.

Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.

Memory corruption while handling user packets during VBO bind operation.

Memory corruption when an invoke call and a TEE call are bound for the same trusted application.

Memory corruption when allocating and accessing an entry in an SMEM partition.

Memory corruption while performing finish HMAC operation when context is freed by keymaster.

Transient DOS while loading the TA ELF file.