Qualcomm ≫ Wcd9370 Firmware

894 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2025-47327

Memory corruption while encoding the image data.

7.8

Memory corruption due to global buffer overflow when a test command uses an invalid payload type.

6.1

Information disclosure when Video engine escape input data is less than expected minimum size.

6.1

information disclosure while invoking calibration data from user space to update firmware size.

7.8

Memory corruption while performing private key encryption in trusted application.

Memory corruption while processing simultaneous requests via escape path.

7.8

Memory corruption while processing IOCTL command with larger buffer in Bluetooth Host.

7.5

Transient DOS while creating NDP instance.

7.5

Transient DOS while processing a frame with malformed shared-key descriptor.

7.5

Transient DOS while processing CCCH data when NW sends data with invalid length.