Qualcomm ≫ Sm7225 Firmware

53 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2023-33080

Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.

7.8

Memory corruption in Audio while running invalid audio recording from ADSP.

7.8

Warning

Memory corruption in DSP Services during a remote call from HLOS to DSP.

7.5

Transient DOS in Data modem while handling TLB control messages from the Network.

7.5

Transient DOS in Modem after RRC Setup message is received.

7.8

Memory corruption in HLOS while invoking IOCTL calls from user-space.

7.8

Memory corruption while using the UIM diag command to get the operators name.

7.8

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

7.8

Memory corruption in Audio while processing the VOC packet data from ADSP.

7.8

Memory Corruption in Audio while invoking callback function in driver from ADSP.