Qualcomm ≫ Sm8350 Firmware

Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length.

Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.

Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information.

Transient DOS due to time-of-check time-of-use race condition in Modem while processing RRC Reconfiguration message.

Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment.

Memory corruption due to double free in core while initializing the encryption key.

u'When a non standard SIP sigcomp message is received from the network, then there may be chances of using more UDVM cycle or memory overflow' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobi...

Possible buffer overflow in Fastrpc while handling received parameters due to lack of validation on input parameters' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in APQ8098, MSM8998, Q...

u'Incorrect validation of ring context fetched from host memory can lead to memory overflow' in Snapdragon Compute, Snapdragon Mobile in QSM8350, SC7180, SDX55, SDX55M, SM6150, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM7250, SM7250P, SM8150, SM8150...

u'Possible integer overflow to heap overflow while processing command due to lack of check of packet length received' in Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile in QSM8350, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155P, SA8195P, ...