Qualcomm

Qcn7606 Firmware

159 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
  • EPSS 0.25%
  • Veröffentlicht 22.02.2021 07:15:14
  • Zuletzt bearbeitet 21.11.2024 04:57:40

Possible denial of service while handling host WMI command due to improper validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, S...

  • EPSS 0.25%
  • Veröffentlicht 22.02.2021 07:15:14
  • Zuletzt bearbeitet 21.11.2024 04:57:41

Denial of service while processing fine timing measurement request (FTMR) frame with reserved bits set in the FTM parameter IE due to improper error handling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electro...

  • EPSS 0.24%
  • Veröffentlicht 22.02.2021 07:15:14
  • Zuletzt bearbeitet 21.11.2024 04:57:41

Allowing RTT frames to be linked with non randomized MAC address by comparing the sequence numbers can lead to information disclosure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snap...

  • EPSS 0.26%
  • Veröffentlicht 21.01.2021 10:15:12
  • Zuletzt bearbeitet 21.11.2024 04:56:50

Buffer over-read can happen when the buffer length received from response handlers is more than the size of the payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer...

  • EPSS 0.19%
  • Veröffentlicht 02.11.2020 07:15:13
  • Zuletzt bearbeitet 21.11.2024 04:56:57

u'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Co...

  • EPSS 0.19%
  • Veröffentlicht 02.11.2020 07:15:13
  • Zuletzt bearbeitet 21.11.2024 04:56:57

u'Buffer overflow while processing PDU packet in bluetooth due to lack of check of buffer length before copying into it.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consum...

  • EPSS 0.29%
  • Veröffentlicht 02.11.2020 07:15:13
  • Zuletzt bearbeitet 21.11.2024 04:57:01

u'Buffer over-read while processing received L2CAP packet due to lack of integer overflow check' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Indust...

  • EPSS 0.04%
  • Veröffentlicht 08.09.2020 10:15:12
  • Zuletzt bearbeitet 21.11.2024 04:19:21

u'SMEM partition can be manipulated in case of any compromise on HLOS, thus resulting in access to memory outside of SMEM address range which could lead to memory corruption' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon...

  • EPSS 0.1%
  • Veröffentlicht 30.07.2020 12:15:11
  • Zuletzt bearbeitet 21.11.2024 04:25:57

Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snap...