Qualcomm

Sd 429 Firmware

121 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
  • EPSS 0.03%
  • Veröffentlicht 11.02.2019 15:29:00
  • Zuletzt bearbeitet 21.11.2024 03:44:07

Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon...

  • EPSS 0.03%
  • Veröffentlicht 11.02.2019 15:29:00
  • Zuletzt bearbeitet 21.11.2024 03:44:12

Unauthorized access may be allowed by the SCP11 Crypto Services TA will processing commands from other TA in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdrag...

  • EPSS 0.04%
  • Veröffentlicht 11.02.2019 15:29:00
  • Zuletzt bearbeitet 21.11.2024 03:44:13

While processing radio connection status change events, Radio index is not properly validated in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile and Snapdragon Voice & Music in versions ...

  • EPSS 0.04%
  • Veröffentlicht 11.02.2019 15:29:00
  • Zuletzt bearbeitet 21.11.2024 03:48:15

There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in vers...

  • EPSS 0.04%
  • Veröffentlicht 18.01.2019 22:29:00
  • Zuletzt bearbeitet 21.11.2024 03:33:40

Improper authorization involving a fuse in TrustZone in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD...

  • EPSS 0.11%
  • Veröffentlicht 18.01.2019 22:29:00
  • Zuletzt bearbeitet 21.11.2024 03:43:02

Lack of check of input size can make device memory get corrupted because of buffer overflow in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, ...

  • EPSS 0.04%
  • Veröffentlicht 18.01.2019 22:29:00
  • Zuletzt bearbeitet 21.11.2024 04:09:34

Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, ...

  • EPSS 0.02%
  • Veröffentlicht 03.01.2019 15:29:01
  • Zuletzt bearbeitet 21.11.2024 03:19:52

Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212...

  • EPSS 0.05%
  • Veröffentlicht 03.01.2019 15:29:00
  • Zuletzt bearbeitet 21.11.2024 03:06:56

A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, S...

  • EPSS 0.04%
  • Veröffentlicht 03.01.2019 15:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:26

When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Sn...