Qualcomm ≫ Sda845 Firmware

233 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-33063

Warnung

Memory corruption in DSP Services during a remote call from HLOS to DSP.

5.5

Transient DOS in Automotive OS due to improper authentication to the secure IO calls.

9.1

Cryptographic issue in GPS HLOS Driver while downloading Qualcomm GNSS assistance data.

7.8

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

7.8

Memory corruption while using the UIM diag command to get the operators name.

7.8

Memory corruption in Audio while processing the VOC packet data from ADSP.

7.8

Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.

7.8

Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload.

7.8

Memory corruption while allocating memory in COmxApeDec module in Audio.

7.8

Memory Corruption in GPU Subsystem due to arbitrary command execution from GPU in privileged mode.