Qualcomm

Msm8996au Firmware

694 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
  • EPSS 0.04%
  • Published 24.05.2019 17:29:01
  • Last modified 21.11.2024 03:44:23

An unprivileged user can issue a binder call and cause a system halt in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MD...

  • EPSS 0.36%
  • Published 24.05.2019 17:29:01
  • Last modified 21.11.2024 03:48:15

Unchecked OTA field in GNSS XTRA3 lead to integer overflow and then buffer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon M...

  • EPSS 0.02%
  • Published 24.05.2019 17:29:01
  • Last modified 21.11.2024 03:48:15

Due to the missing permissions on several content providers of the RCS app in its android manifest file will lead to an unprivileged access to phone in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon ...

  • EPSS 0.03%
  • Published 06.05.2019 23:29:00
  • Last modified 21.11.2024 03:19:25

In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 8...

  • EPSS 0.09%
  • Published 06.05.2019 23:29:00
  • Last modified 21.11.2024 03:19:27

While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20.

  • EPSS 0.09%
  • Published 06.05.2019 23:29:00
  • Last modified 21.11.2024 03:19:27

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, ...

  • EPSS 0.04%
  • Published 06.05.2019 23:29:00
  • Last modified 21.11.2024 03:19:45

Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, ...

  • EPSS 0.03%
  • Published 04.04.2019 15:29:00
  • Last modified 21.11.2024 03:44:06

Improper input validation in QCPE create function may lead to integer overflow in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 410/12,...

  • EPSS 0.03%
  • Published 04.04.2019 15:29:00
  • Last modified 21.11.2024 03:44:20

Undefined behavior in UE while processing unknown IEI in OTA message in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, M...

  • EPSS 0.1%
  • Published 25.02.2019 22:29:02
  • Last modified 21.11.2024 03:43:04

Data truncation during higher to lower type conversion which causes less memory allocation than desired can lead to a buffer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapd...