Qualcomm

Sdm636 Firmware

244 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
  • EPSS 0.03%
  • Veröffentlicht 21.11.2019 15:15:12
  • Zuletzt bearbeitet 21.11.2024 04:19:15

Race condition due to the lack of resource lock which will be concurrently modified in the memcpy statement leads to out of bound access in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial ...

  • EPSS 0.04%
  • Veröffentlicht 21.11.2019 15:15:12
  • Zuletzt bearbeitet 21.11.2024 04:19:17

Out-of-bounds access can occur in camera driver due to improper validation of array index in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Musi...

  • EPSS 0.04%
  • Veröffentlicht 21.11.2019 15:15:12
  • Zuletzt bearbeitet 21.11.2024 04:19:27

Buffer over-read can occur in fast message handler due to improper input validation while processing a message from firmware in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdra...

  • EPSS 0.4%
  • Veröffentlicht 06.11.2019 17:15:13
  • Zuletzt bearbeitet 21.11.2024 04:40:39

While processing vendor command which contains corrupted channel count, an integer overflow occurs and finally will lead to heap overflow. in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industria...

  • EPSS 0.03%
  • Veröffentlicht 06.05.2019 23:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:25

In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 8...

  • EPSS 0.03%
  • Veröffentlicht 06.05.2019 23:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:28

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Me...

  • EPSS 0.04%
  • Veröffentlicht 06.05.2019 23:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:45

Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, ...

  • EPSS 0.03%
  • Veröffentlicht 29.10.2018 18:29:03
  • Zuletzt bearbeitet 21.11.2024 03:44:10

Buffer overwrite can happen in WLAN function while processing set pdev parameter command due to lack of input validation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version IPQ4019, IPQ8064, IPQ8074, MDM9206, MDM9607, MDM9635M, MD...

  • EPSS 0.03%
  • Veröffentlicht 29.10.2018 18:29:02
  • Zuletzt bearbeitet 21.11.2024 03:44:09

Integer overflow may happen in WLAN when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version IPQ8074, MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, S...

  • EPSS 0.03%
  • Veröffentlicht 29.10.2018 18:29:01
  • Zuletzt bearbeitet 21.11.2024 03:44:09

Integer overflow may happen when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD...