Qualcomm

Sd 625 Firmware

434 Schwachstellen gefunden.

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  • EPSS 0.03%
  • Veröffentlicht 06.05.2019 23:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:25

In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 8...

  • EPSS 0.09%
  • Veröffentlicht 06.05.2019 23:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:27

While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20.

  • EPSS 0.09%
  • Veröffentlicht 06.05.2019 23:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:27

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, ...

  • EPSS 0.03%
  • Veröffentlicht 06.05.2019 23:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:28

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Me...

  • EPSS 0.04%
  • Veröffentlicht 06.05.2019 23:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:44

While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mob...

  • EPSS 0.05%
  • Veröffentlicht 06.05.2019 23:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:44

A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415...

  • EPSS 0.04%
  • Veröffentlicht 06.05.2019 23:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:45

An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobil...

  • EPSS 0.04%
  • Veröffentlicht 06.05.2019 23:29:00
  • Zuletzt bearbeitet 21.11.2024 03:19:45

Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, ...

  • EPSS 0.05%
  • Veröffentlicht 04.04.2019 15:29:00
  • Zuletzt bearbeitet 21.11.2024 03:44:19

Insufficient protection of keys in keypad can lead HLOS to gain access to confidential keypad input data in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdrag...

  • EPSS 0.03%
  • Veröffentlicht 04.04.2019 15:29:00
  • Zuletzt bearbeitet 21.11.2024 03:44:20

Undefined behavior in UE while processing unknown IEI in OTA message in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, M...