Qualcomm

Sd 210 Firmware

423 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
7.8

CVE-2017-18329

  • EPSS 0.04%
  • Published 03.01.2019 15:29:01
  • Last modified 21.11.2024 03:19:52

Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 43...

7.8

CVE-2017-18330

  • EPSS 0.02%
  • Published 03.01.2019 15:29:01
  • Last modified 21.11.2024 03:19:52

Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212...

5.5

CVE-2017-11004

  • EPSS 0.05%
  • Published 03.01.2019 15:29:00
  • Last modified 21.11.2024 03:06:56

A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, S...

7.8

CVE-2017-18141

  • EPSS 0.04%
  • Published 03.01.2019 15:29:00
  • Last modified 21.11.2024 03:19:26

When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Sn...

5.5

CVE-2017-18319

  • EPSS 0.05%
  • Published 03.01.2019 15:29:00
  • Last modified 21.11.2024 03:19:50

Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450...

5.5

CVE-2017-18322

  • EPSS 0.05%
  • Published 03.01.2019 15:29:00
  • Last modified 21.11.2024 03:19:51

Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427...

5.5

CVE-2017-18323

  • EPSS 0.05%
  • Published 03.01.2019 15:29:00
  • Last modified 21.11.2024 03:19:51

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD...

5.5

CVE-2017-18324

  • EPSS 0.05%
  • Published 03.01.2019 15:29:00
  • Last modified 21.11.2024 03:19:51

Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 43...

5.5

CVE-2017-18326

  • EPSS 0.05%
  • Published 03.01.2019 15:29:00
  • Last modified 21.11.2024 03:19:51

Cryptographic keys are printed in modem debug messages in snapdragon mobile and snapdragon wear in versions MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD...

5.5

CVE-2017-18327

  • EPSS 0.05%
  • Published 03.01.2019 15:29:00
  • Last modified 21.11.2024 03:19:52

Security keys are logged when any WCDMA call is configured or reconfigured in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, S...