Qualcomm ≫ Snapdragon 855 Mobile Firmware

38 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2024-21477

Transient DOS while parsing a protected 802.11az Fine Time Measurement (FTM) frame.

7.8

Memory corruption when the payload received from firmware is not as per the expected protocol size.

7.8

Memory corruption in HLOS while checking for the storage type.

7.5

Transient DOS while processing IKEv2 Informational request messages, when a malformed fragment packet is received.

Memory corruption while loading a VM from a signed VM image that is not coherent in the processor cache.

7.8

Memory corruption when there is failed unmap operation in GPU.

7.5

Transient DOS while processing DL NAS TRANSPORT message with payload length 0.

7.5

Transient DOS while processing SMS container of non-standard size received in DL NAS transport in NR.

7.8

Memory corruption while processing buffer initialization, when trusted report for certain report types are generated.

7.8

Memory corruption while processing finish_sign command to pass a rsp buffer.