Qualcomm ≫ Snapdragon 460 Mobile Platform Firmware

Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size.

Memory corruption when allocating and accessing an entry in an SMEM partition.

Memory corruption when an invoke call and a TEE call are bound for the same trusted application.

Memory corruption while processing key blob passed by the user.

Transient DOS while loading the TA ELF file.

Memory corruption while performing finish HMAC operation when context is freed by keymaster.

Transient DOS while parse fils IE with length equal to 1.

Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame.

Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL.

Memory corruption in video while parsing the Videoinfo, when the size of atom is greater than the videoinfo size.