Qualcomm

Vision Intelligence 400 Firmware

48 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
  • EPSS 0.04%
  • Published 03.02.2025 17:15:18
  • Last modified 05.02.2025 13:56:27

Memory corruption while configuring a Hypervisor based input virtual device.

  • EPSS 0.04%
  • Published 02.09.2024 12:15:18
  • Last modified 11.08.2025 15:06:17

Memory corruption when user provides data for FM HCI command control operations.

  • EPSS 0.02%
  • Published 02.09.2024 12:15:18
  • Last modified 11.08.2025 15:06:17

Memory corruption when two threads try to map and unmap a single node simultaneously.

  • EPSS 0.26%
  • Published 02.09.2024 12:15:18
  • Last modified 11.08.2025 15:06:17

Transient DOS while parsing the multi-link element Control field when common information length check is missing before updating the location.

  • EPSS 0.17%
  • Published 02.09.2024 12:15:17
  • Last modified 11.08.2025 15:06:17

Transient DOS while processing TIM IE from beacon frame as there is no check for IE length.

  • EPSS 0.26%
  • Published 02.09.2024 12:15:17
  • Last modified 11.08.2025 15:06:17

Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper.

  • EPSS 0.04%
  • Published 02.09.2024 12:15:16
  • Last modified 11.08.2025 15:06:17

Memory corruption when BTFM client sends new messages over Slimbus to ADSP.

  • EPSS 0.04%
  • Published 02.09.2024 12:15:16
  • Last modified 11.08.2025 15:06:17

Memory corruption when Alternative Frequency offset value is set to 255.

  • EPSS 0.1%
  • Published 03.06.2024 10:15:11
  • Last modified 11.08.2025 15:06:17

Cryptographic issue while performing attach with a LTE network, a rogue base station can skip the authentication phase and immediately send the Security Mode Command.

  • EPSS 0.04%
  • Published 03.06.2024 10:15:10
  • Last modified 11.08.2025 15:06:17

Memory corruption while copying a keyblob`s material when the key material`s size is not accurately checked.