Qualcomm ≫ Snapdragon 845 Firmware

11 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

6.5

CVE-2024-43056

Transient DOS during hypervisor virtual I/O operation in a virtual machine.

7.5

Transient DOS while processing TIM IE from beacon frame as there is no check for IE length.

7.8

Memory corruption when Alternative Frequency offset value is set to 255.

7.8

Memory corruption in WLAN HAL while handling command streams through WMI interfaces.

7.8

Memory corruption in WLAN HAL while handling command through WMI interfaces.

7.8

Memory corruption in WLAN HAL while passing command parameters through WMI interfaces.

6.8

Memory Corruption in Modem due to double free while parsing the PKCS15 sim files.

7.8

Arbitrary memory overwrite when VM gets compromised in TX write leading to Memory Corruption.

7.8

Memory Corruption in Audio while allocating the ion buffer during the music playback.

7.8

Memory Corruption in Data Modem while processing DMA buffer release event about CFR data.