Qualcomm ≫ Snapdragon 8 Gen 1 Firmware

44 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2024-43062

Memory corruption caused by missing locks and checks on the DMA fence and improper synchronization.

7.8

Memory corruption while processing command in Glink linux.

6.5

Transient DOS during hypervisor virtual I/O operation in a virtual machine.

7.8

Memory corruption while processing camera use case IOCTL call.

5.5

Information disclosure while deriving keys for a session for any Widevine use case.

5.3

While processing the authentication message in UE, improper authentication may lead to information disclosure.

7.5

Transient DOS while processing TIM IE from beacon frame as there is no check for IE length.

7.5

Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper.

7.8

Memory corruption when BTFM client sends new messages over Slimbus to ADSP.

7.8

Memory corruption when Alternative Frequency offset value is set to 255.