Qualcomm ≫ Snapdragon 8 Gen 1 Firmware

39 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2024-43057

Memory corruption while processing command in Glink linux.

7.5

Transient DOS while processing TIM IE from beacon frame as there is no check for IE length.

7.5

Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper.

7.8

Memory corruption when BTFM client sends new messages over Slimbus to ADSP.

7.8

Memory corruption when Alternative Frequency offset value is set to 255.

7.8

Memory corruption while passing untrusted/corrupted pointers from DSP to EVA.

7.5

Transient DOS in WLAN Host when a mobile station receives invalid channel in CSA IE while doing channel switch announcement (CSA).

7.8

Memory corruption in Graphics while processing user packets for command submission.

7.5

Transient DOS in WLAN firmware while parsing MLO (multi-link operation).

7.5

Transient DOS in WLAN Firmware while interpreting MBSSID IE of a received beacon frame.