Qualcomm ≫ Fastconnect 6200 Firmware

272 Schwachstellen gefunden.

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7.5

CVE-2023-28588

Transient DOS in Bluetooth Host while rfc slot allocation.

7.8

Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments.

8.8

Memory corruption while loading an ELF segment in TEE Kernel.

6.5

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

7.8

Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.

7.8

Memory Corruption in Radio Interface Layer while sending an SMS or writing an SMS to SIM.

7.8

Memory Corruption in camera while installing a fd for a particular DMA buffer.

7.8

Memory Corruption in Audio while invoking IOCTLs calls from the user-space.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.

7.8

Memory corruption in MPP performance while accessing DSM watermark using external memory address.