Qualcomm ≫ Snapdragon 670 Mobile Platform Firmware

80 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2024-38423

Memory corruption while processing GPU page table switch.

7.8

Memory corruption while processing voice packet with arbitrary data received from ADSP.

7.8

Memory corruption while invoking IOCTL calls from the use-space for HGSL memory node.

7.8

Memory corruption while handling session errors from firmware.

5.5

Transient DOS while handling PS event when Program Service name length offset value is set to 255.

6.8

memory corruption when an invalid firehose patch command is invoked.

7.1

Cryptographic issue while parsing RSA keys in COBR format.

7.8

Memory corruption can occur when arbitrary user-space app gains kernel level privilege to modify DDR memory by corrupting the GPU page table.

7.5

Transient DOS while parsing ESP IE from beacon/probe response frame.

5.5

Transient DOS while importing a PKCS#8-encoded RSA key with zero bytes modulus.