Qualcomm

Snapdragon 670 Mobile Platform Firmware

67 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
  • EPSS 0.11%
  • Published 01.07.2024 15:15:16
  • Last modified 21.11.2024 08:57:39

Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.

  • EPSS 0.08%
  • Published 01.07.2024 15:15:15
  • Last modified 21.11.2024 08:57:37

Memory corruption when allocating and accessing an entry in an SMEM partition.

  • EPSS 0.09%
  • Published 01.07.2024 15:15:15
  • Last modified 21.11.2024 08:54:28

Memory corruption when an invoke call and a TEE call are bound for the same trusted application.

  • EPSS 0.08%
  • Published 01.07.2024 15:15:14
  • Last modified 21.11.2024 08:54:26

Transient DOS while loading the TA ELF file.

  • EPSS 0.1%
  • Published 01.07.2024 15:15:14
  • Last modified 21.11.2024 08:54:25

Memory corruption while performing finish HMAC operation when context is freed by keymaster.

  • EPSS 0.1%
  • Published 01.07.2024 15:15:14
  • Last modified 21.11.2024 08:54:27

Memory corruption while processing key blob passed by the user.

  • EPSS 0.12%
  • Published 06.02.2024 06:16:03
  • Last modified 11.08.2025 15:06:17

Transient DOS while parse fils IE with length equal to 1.

  • EPSS 0.12%
  • Published 06.02.2024 06:16:02
  • Last modified 11.08.2025 15:06:17

Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame.

  • EPSS 0.11%
  • Published 06.02.2024 06:16:01
  • Last modified 11.08.2025 15:06:17

Memory corruption in video while parsing invalid mp2 clip.

  • EPSS 0.05%
  • Published 06.02.2024 06:16:01
  • Last modified 11.08.2025 15:06:17

Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element.