Qualcomm

Snapdragon 210 Processor Firmware

47 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
  • EPSS 0.14%
  • Published 02.01.2024 06:15:12
  • Last modified 11.08.2025 15:06:17

Memory corruption in Audio when memory map command is executed consecutively in ADSP.

  • EPSS 0.06%
  • Published 02.01.2024 06:15:09
  • Last modified 21.11.2024 08:04:31

Memory corruption in Audio during playback with speaker protection.

  • EPSS 0.06%
  • Published 02.01.2024 06:15:09
  • Last modified 21.11.2024 08:04:30

Memory corruption in HLOS while running playready use-case.

Warning
  • EPSS 0.07%
  • Published 05.12.2023 03:15:14
  • Last modified 11.08.2025 15:06:17

Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.

  • EPSS 0.05%
  • Published 05.12.2023 03:15:12
  • Last modified 11.08.2025 15:06:17

Transient DOS in Automotive OS due to improper authentication to the secure IO calls.

Warning
  • EPSS 0.23%
  • Published 05.12.2023 03:15:12
  • Last modified 11.08.2025 15:06:17

Memory corruption in DSP Services during a remote call from HLOS to DSP.

  • EPSS 0.06%
  • Published 05.12.2023 03:15:10
  • Last modified 11.08.2025 15:06:17

Memory corruption while using the UIM diag command to get the operators name.

  • EPSS 0.06%
  • Published 05.12.2023 03:15:10
  • Last modified 11.08.2025 15:06:17

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

  • EPSS 0.44%
  • Published 05.12.2023 03:15:10
  • Last modified 11.08.2025 15:06:17

Transient DOS in Bluetooth Host while rfc slot allocation.

  • EPSS 0.04%
  • Published 05.12.2023 03:15:09
  • Last modified 11.08.2025 15:06:17

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.