Qualcomm ≫ Sm8250-ab Firmware

75 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2023-21661

Transient DOS while parsing WLAN beacon or probe-response frame.

7.5

Transient DOS in WLAN Firmware while processing frames with missing header fields.

7.5

Transient DOS in WLAN Firmware while processing the received beacon or probe response frame.

7.8

Memoru corruption in Audio when ADSP sends input during record use case.

7.8

Memory corruption in WLAN HOST while receiving an WMI event from firmware.

7.5

Transient DOS due to improper authentication in modem while receiving plain TLB OTA request message from network.

5.5

Transient DOS due to untrusted Pointer Dereference in core while sending USB QMI request.

7.8

Memory corruption due to improper access control in kernel while processing a mapping request from root process.

5.5

Information disclosure in Kernel due to indirect branch misprediction.

7.5

Transient DOS due to improper authorization in Modem