7.8
CVE-2019-14051
- EPSS 0.04%
- Veröffentlicht 07.02.2020 05:15:11
- Zuletzt bearbeitet 21.11.2024 04:25:59
- Quelle product-security@qualcomm.com
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Subsequent additions performed during Module loading while allocating the memory would lead to integer overflow and then to buffer overflow in Snapdragon Industrial IOT in MDM9206, MDM9607
Daten sind bereitgestellt durch National Vulnerability Database (NVD)
Qualcomm ≫ Mdm9206 Firmware Version-
Qualcomm ≫ Mdm9607 Firmware Version-
Zu dieser CVE wurde keine CISA KEV oder CERT.AT-Warnung gefunden.
Typ | Quelle | Score | Percentile |
---|---|---|---|
EPSS | FIRST.org | 0.04% | 0.066 |
Quelle | Base Score | Exploit Score | Impact Score | Vector String |
---|---|---|---|---|
nvd@nist.gov | 7.8 | 1.8 | 5.9 |
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
|
nvd@nist.gov | 7.2 | 3.9 | 10 |
AV:L/AC:L/Au:N/C:C/I:C/A:C
|
CWE-190 Integer Overflow or Wraparound
The product performs a calculation that can produce an integer overflow or wraparound when the logic assumes that the resulting value will always be larger than the original value. This occurs when an integer value is incremented to a value that is too large to store in the associated representation. When this occurs, the value may become a very small or negative number.